Samsung exynos® 3475
Benchmarks.Samsung Exynos review | 68 facts and shows
Samsung Exynos (ARM Cortex-A7) a technology integrated into the processor to secure the product for usage with features such as for example cellular payments and streaming video using digital rights management (DRM). Show more Specs +. Sep 11, · Samsung Exynos 3 Quad (Island) datasheet: , Multi-core Application Processor with Modem, 32 bit, quad-core, mobile (LP) DDR2 SDRAM, mobile (LP) DDR3 SDRAM, 28 nm, ARM Mali-T GPU, MHz GPU, CSD kbps, GPRS (course unspecified), UMTS kbps (W-CDMA), HSDPA (Cat. unspecified), HSUPA (Cat. unspecified), LTE (Cat. unspecified), LTE . Samsung Exynos (ARM Cortex-A7) A technology integrated into the processor to secure these devices to be used with features such cellular repayments and streaming video .
Samsung exynos® 3475.Qualcomm Snapdragon vs Samsung Exynos What is the huge difference?
Sep 11, · 71xx mm, Google Android (Lollipop), Samsung Exynos 3 Quad (Island), GiB RAM, 16 GB ROM, 5 inches, x, MP camera, MP second cam, Sep 11, · Samsung Exynos 3 Quad (Island) datasheet: , Multi-core Application Processor with Modem, 32 bit, quad-core, mobile (LP) DDR2 SDRAM, cellular (LP) DDR3 SDRAM, 28 nm, ARM Mali-T GPU, MHz GPU, CSD kbps, GPRS (Class unspecified), UMTS kbps (W-CDMA), HSDPA (Cat. unspecified), HSUPA (Cat. unspecified), LTE (Cat. unspecified), LTE . Samsung Exynos (supply Cortex-A7) A technology integrated into the processor to secure these devices to be used with functions such as for example cellular repayments and streaming video .
Samsung Exynos 3475 Quad
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Samsung Exynos 3475 review: specs and price
Exactly why is Qualcomm Snapdragon 410 better than Samsung Exynos 3475?
Samsung Exynos Quad SoC – Benchmarks and Specs – Tech
Help us by suggesting a value. Samsung Exynos Qualcomm Snapdragon Overview Rates Specs. Why is Qualcomm Snapdragon a lot better than Samsung Exynos ? Features incorporated LTE. Scroll down for more information. Exactly why is Samsung Exynos a lot better than Qualcomm Snapdragon ? That are widely known evaluations? Price contrast. General info 1. It allows you to run bit apps. Tiny semiconductors supply better performance and reduced power consumption. Chipsets with a greater amount of transistors, semiconductor aspects of electric products, offer more computational power.
A little form factor allows much more transistors to fit on a chip, therefore increasing its performance. The graphics processing unit GPU has an increased time clock speed. DirectX version 9. DirectX is employed in games, with more recent versions encouraging better illustrations.
OpenGL ES version 3. OpenGL ES is employed for games on mobile devices such as for example smartphones. Newer variations help better pictures. The fifth-generation wireless innovation provides higher rates and lower latency than the previous, fourth-generation tech.
GPU turbo Unknown. Once the GPU is operating below its limits, it can boost to a greater clock rate to be able to offer increased performance.
OpenCL version 1. Newer versions introduce more functionality and better performance. Efficiency 1. CPU speed 4 x 1. The Central Processing Unit speed shows just how many processing cycles per second is performed by a CPU, thinking about every one of its cores processing units.
Its determined by the addition of the time clock prices of every core or, in the case of multi-core processors employing different microarchitectures, of each and every group of cores. CPU threads 4. More threads result in faster performance and better multitasking. Uses big. Utilizing big. LITTLE technology, a chip can change between two sets of processor cores to increase performance and battery pack life.
For instance, when playing a casino game the greater effective cores will be utilized to boost performance, whereas checking e-mail will use the less effective cores to increase battery pack life. In this setup, a processor can use all cores at the same time, or simply just one core for low-intensity tasks. This will supply powerful performance or increased electric battery life respectively.
Whenever Central Processing Unit is operating below its limits, it may boost to an increased clock speed in order to give increased performance. L2 cache Unknown. A larger L2 cache results in faster Central Processing Unit and system-wide performance. L1 cache 32KB. A bigger L1 cache results in faster Central Processing Unit and system-wide performance. The clock multiplier manages the rate of the CPU. L3 cache Unknown. A larger L3 cache results in quicker Central Processing Unit and system-wide performance.
Memory 1. RAM speed MHz. It can help faster memory, which will offer quicker system performance. Here is the optimum rate that information could be read from or kept into memory. More memory channels escalates the rate of information transfer involving the memory together with CPU. A higher version of eMMC allows faster memory interfaces, having an optimistic influence on the performance of a computer device. For example, when transferring data from your computer to your interior storage space over USB.
Error-correcting code memory can detect and correct information corruption. It really is made use of when is it important to stay away from corruption, such as for example systematic processing or when working a server. DDR memory version Unknown.
Newer versions of DDR memory support higher maximum rates and therefore are more energy-efficient. The bus accounts for transferring data between different the different parts of a computer or unit. Features 1. LTE is capable of downloading at faster speeds than older, 3G technology. The download speed is a measurement associated with connection to the internet bandwidth, representing the most data transfer rate from which a computer device can access internet based content.
Dynamic frequency scaling is a technology which allows the processor to save energy and lower noise if it is under a light load. NX bit helps protect the pc from destructive assaults. AES is employed to accelerate encryption and decryption.
an innovation integrated into the processor to secure these devices to be used with features such as for example cellular repayments and streaming video using digital legal rights management DRM.
The upload rate is a measurement of this connection to the internet bandwidth, representing the most information transfer rate at which a device can send information to a server or another product. Vector Floating-Point VFP is employed by the processor to deliver increased performance in areas such digital imaging. Benchmarks 1. PassMark result Unknown. This benchmark steps the performance associated with the Central Processing Unit utilizing numerous threads.
PassMark result single Unknown. This standard steps the performance associated with the Central Processing Unit using a single bond. Geekbench 5 result single Unknown. Geekbench 5 is a cross-platform benchmark that steps a processor’s single-core performance.
Supply: Primate Labs, Cinebench R20 single result Unknown. Cinebench R20 is a benchmark tool that steps a CPU’s single-core performance by making a 3D scene.
Cinebench R20 multi result Unknown. Cinebench R20 is a benchmark device that steps a Central Processing Unit’s multi-core performance by rendering a 3D scene.
Geekbench 5 result multi Unknown. Geekbench 5 is a cross-platform benchmark that measures a processor’s multi-core performance. PassMark result overclocked Unknown.
This benchmark measures the performance of the CPU if it is overclocked. Miscellaneous 1. The amount of pixels that can be rendered towards the display screen every second. Floating-point performance is a measurement of this natural processing energy of the GPU.
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Intel Xeon with six cores announced on September 15
Intel is anticipated to officially unveil the Xeon 7400 “Dunnington” server processor on September 15, which is the planet’s first six-core chip together with last member of the Penryn family, in accordance with sources close to server producers. Later on, Penryn will soon be changed by processors in line with the Nehalem structure, its first available on the market will soon be represented by Core i7 chips, planned for release within the fourth one-fourth with this 12 months. In his speeches at the latest IDF, Intel VP Pat Gelsinger said Sun Microsystems, Hewlett-Packard and Dell are planning the statement of Dunnington-based machines. Almost certainly, comparable items will also be circulated by IBM and Unisys.
Xeon 7400 should deliver outstanding performance with six cores and 16MB of shared cache. In addition, the new processor chip is significant for the truth that it is initial implementation of a “monolithic” design in Intel rehearse, in which all cores will be situated on a single die. Dunnington is likely to be manufactured using 45nm high-k technology in the mPGA 604 design, and can retain pin compatibility with Tigerton quad cores.
Recall that Dunnigton chips are solutions for multiprocessor computers. For the creation of six-core chips, Intel makes use of 45nm innovation using material gates and High-K dielectrics, which will accommodate 1.9 billion transistors for a passing fancy chip. All six cores, along with arrays of cache cells, will fit for a passing fancy die, even though some observers formerly believed Intel would merely bring three dual-core Wolfdale dies into one package.
Dunnington Processors Adopt Tiered Shared Cache Concept. For every pair of cores there was one assortment of L2 cache cells with a capacity of 3 MB, respectively, the sum total L2 cache achieves 9 MB. Also, the chip will house a shared third-level cache, the capability that would be up to 16 MB. Remember that the predecessors of Dunnington, quad-core potato chips of the Xeon 7300 series (Tigerton) for multiprocessor servers, have actually as much as 8 MB of L3 cache.
Among various other technical features of Dunnington, known these days, we note the FSB bus with a throughput of 1066 megatransactions per second, a 40-bit physical memory handling plan; familiar mPGA604 packaging; TDP 130W; support for VT FlexMigration virtualization technology with high compatibility and help for migration to future platforms with Core structure or subsequent microarchitectures.
– Intel to market 100 millionth 45nm chip by year-end;
– Development associated with the time: technologies for enhancing the effectiveness of Nehalem processors.